▎ 摘　　要

NOVELTY - Preparing oriented thermally conductive sheet, comprises (1) preparing fluid composition for thermally conductive sheet, (2) placing the fluid composition obtained in step (1) in orientation molding device, applying the high-speed shearing force of circumferential movement to the fluid composition layer by layer, orienting thermally conductive filler in the fluid composition along the shearing direction to form oriented thin-layer composition, and collecting the thin-layer composition in the mold layer by layer to form continuous multi-layer assembly, (3) thermally curing the multi-layer assembly obtained in step (2) to obtain oriented composition block, and (4) slicing the oriented composition block obtained in step (3) along the direction perpendicular to the orientation to obtain final product. USE - The oriented thermally conductive sheet is useful in semiconductor radiating device (claimed). ADVANTAGE - The assembly prepared by the above method has excellent orientation, few defects and high efficiency. The thermally conductive sheet has high orientation, high thermal conductivity and uniformity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) oriented thermally conductive sheet prepared by the above method; and (2) semiconductor radiating device comprising the oriented thermally conductive sheet, where the oriented thermally conductive sheet is sandwiched between packaged chip and radiator.