• 专利标题:   Preparing carbon-based composite filler useful for thermal interface material, comprises performing surface hydroxylation treatment on carbon films, soaking hydroxylated carbon film in saturated metal salt solution, taking out, drying to obtain metal salt-loaded carbon film, and heating.
  • 专利号:   CN114031815-A, CN114031815-B
  • 发明人:   ZHOU R
  • 专利权人:   WAROM LIGHTING CO LTD
  • 国际专利分类:   C08K003/04, C08K003/22, C08K009/02, C08K009/12, C08L063/02, H01L033/56, H01L033/64
  • 专利详细信息:   CN114031815-A 11 Feb 2022 C08K-009/02 202251 Chinese
  • 申请详细信息:   CN114031815-A CN11602599 24 Dec 2021
  • 优先权号:   CN11602599

▎ 摘  要

NOVELTY - Preparing carbon-based composite filler comprises (i) performing surface hydroxylation treatment on carbon films by three-electrode cyclic voltammetry; separating the carbon film, washing the carbon film with deionized water, and drying to obtain hydroxylated carbon film; (ii) soaking the hydroxylated carbon film in saturated metal salt solution, taking out the carbon film after soaking for 6-12 hours, drying to obtain metal salt-loaded carbon film; the saturated metal salt solution contains aluminum sulfate, zinc chloride and/or magnesium chloride; and (iii) heating the metal salt-loaded carbon film with 30-60V direct current in oxygen atmosphere for 150-500 ms to obtain carbon-based composite filler; or heating the metal salt-loaded carbon film with 30-60V direct current under atmosphere of inert protective gas for 150-500 ms, turning off power, introducing oxygen to convert metal salts into metal oxides to obtain carbon-based composite filler. USE - The carbon-based composite filler is useful for thermal interface material used in LED packaging (all claimed). ADVANTAGE - The carbon-based composite filler: has high thermal conductivity. The thermal interface material: has high thermal conductivity, high insulation and low water absorption, and is especially suitable for use as LED packaging material DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) carbon-based composite filler is prepared by above mentioned method; and (2) Thermal interface material, which is prepared from epoxy resin, active diluent and filler, filler is prepared by above mentioned method, the filler accounts for 0.5-5 wt.% of the total mass of the thermal interface material preparation raw materials.