▎ 摘　　要

NOVELTY - In this invention, graphene or carbon nanotube is used with existing semiconductor elements, such as LED photoelectric elements or IC electronic elements, for the heat dissipation purpose, such that the advantages of high thermal transfer coefficient and uniform heat conduction of the graphene or carbon nanotube can be used to increase the overall heat dissipation effect, wherein binding adhesive is provided between the electronic/photoelectric element and a soaking block, and the binding adhesive comprises at least resin and graphene or resin and carbon nanotube, provided that the weight percentage of the graphene or carbon nanotube is less than or equal to 10 wt% of the resin. Alternatively, the active surface of the photoelectric element, such as the light emitting surface of an LED, is provided with a transparent heat dissipating package material which comprises at least resin and transparent graphene or resin and transparent carbon nanotube, provided that the weight percentage of the transparent graphene or transparent carbon nanotube is less than or equal to 10 wt% of the resin. Using the properties of the transparent graphene or carbon nanotube, such as high thermal transfer coefficient, uniform heat conduction, and transparency, this invention provides a heat dissipation pathway different from the conventional ones to greatly reduce heat dissipation parts required, satisfying the heat dissipation requirement of the product and achieving purpose of compact product.