▎ 摘　　要

NOVELTY - Heat dissipating device (20), disposed on a circuit board (10), comprises: a first glue layer (202), disposed on the circuit board; a first graphene composite heat dissipating layer (204), jointing to the first glue layer; a second glue layer (206), jointing to the first graphene composite heat dissipating layer; a second graphene composite heat dissipating layer, jointing to the second glue layer; and a resin layer, disposed on the second graphene composite heat dissipating layer, where many first metal particles are respectively doped in the first glue layer, the first graphene composite heat dissipating layer the second glue layer and the second graphene composite heat dissipating layer and each of the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer is covered by a metal layer. USE - Used as heat dissipating device. ADVANTAGE - The device: is simple, space-saving, and has good thermal conductivity; utilizes metal layer that covers the first graphene composite heat dissipating layer and second graphene composite heat dissipating layer, respectively for reducing the nonflatness and undulation and enhancing the attachment efficiency, thus, the thermal conduction performance of the device can be improved; and utilizes heat dissipating member that is attached to the device, partial heat from the device can be transferred to the heat dissipating member for reducing the temperature of the circuit board and hence improving the operating performance of the circuit board. DESCRIPTION OF DRAWING(S) - The figure shows a side view of the heat dissipating device. Circuit board (10) Heat dissipating device (20) First glue layer (202) First graphene composite heat dissipating layer (204) Second glue layer (206)