• 专利标题:   Alumina ceramic substrate for durable packaging, has lower graphene heat conducting layer that is integrally connected with lower end of each heat conducting column and exposed on lower surface of buffer layer.
  • 专利号:   CN217387149-U
  • 发明人:   KONG S, GUO X, HE H, KANG W
  • 专利权人:   JIANGXI LATTICE GRAND ADVANCED MATERIAL
  • 国际专利分类:   H01L023/31, H01L023/367, H01L023/48, H01L023/498
  • 专利详细信息:   CN217387149-U 06 Sep 2022 H01L-023/498 202286 Chinese
  • 申请详细信息:   CN217387149-U CN21120110 11 May 2022
  • 优先权号:   CN21120110

▎ 摘  要

NOVELTY - The utility model claims an alumina ceramic substrate for durable packaging, comprising a main body, a reflecting cup, a buffer layer, an upper line layer, a lower line layer, an upper graphene heat conducting layer and a lower graphene heat conducting layer; the upper and lower surface of the main body is formed with a conductive hole and a plurality of heat conducting holes, the conductive hole is filled with metal to form a conductive column, each heat conducting hole is filled with graphene material to form a heat conducting column. The main body is designed to be composed of a main body comprising a base layer, an upper alumina coating layer, a titanium-tungsten coating layer, lower alumina coating layer and lower titanium tungsten coating layer, so that each layer structure is connected stably, it is not easy to fall off, at the same time, it is matched with a buffer layer to play a role of buffering, it effectively improves the durability of the product, prolongs the service life of the product, and is provided with a heat conducting column by matching, upper graphene heat conducting layer and lower graphene heat conducting layer, the heat can be quickly derived, realizing better radiating effect.