▎ 摘　　要

NOVELTY - Microelectronic assembly solder paste comprises tin powder and flux, where the weight ratio of the tin powder to the flux is (82-95):(8-15), and the tin powder is: 80-90 pts. wt. tin, 1-2 pts. wt. silver, 1.5-2 pts. wt. copper, 0.5-1.5 pts. wt. graphene, 0.5-1 pts. wt. graphene dispersant, the flux includes: 4-6 pts. wt. rosin, 3-5 pts. wt. solvent, 0.8-2 pts. wt. activator, 0.2-0.5 pts. wt. thixotropic agent, 0.1-0.5 pts. wt. powder of antioxidant, and 0.5-1 pts. wt. solder paste dispersant. USE - Used as microelectronic assembly solder paste. ADVANTAGE - The solder paste: uses graphene, whcih can be uniformly dispersed in tin powder through the graphene dispersant, can prevents graphene from agglomerating when tin powder and flux are mixed, improves the uniformity of graphene dispersion in the entire solder paste system, and is beneficial to maintain uniform heat dissipation after welding. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the microelectronic assembly soldering paste.