• 专利标题:   Thermal conductive material for electronic packaging, is made of thermal conductive hollow particles chosen from carbon nanotube, graphene, graphite nanosheet, aluminum nitride, boron nitride and aluminum oxide, in polymer resin.
  • 专利号:   KR2013041554-A, KR1274975-B1
  • 发明人:   LEE S S, KIM J K, LIM S H, PARK M, KIM H, SU L S, GYEONG K J, HO I S, SUK K H
  • 专利权人:   KOREA INST SCI TECHNOLOGY
  • 国际专利分类:   C08K003/04, C09K003/10, C09K005/14
  • 专利详细信息:   KR2013041554-A 25 Apr 2013 C09K-005/14 201379 Pages: 16
  • 申请详细信息:   KR2013041554-A KR105886 17 Oct 2011
  • 优先权号:   KR105886

▎ 摘  要

NOVELTY - A thermal conductive material is made of thermal conductive hollow particles dispersed in a polymer resin. The sieve is chosen from carbon nanotube, graphene, graphite nanosheet, aluminum nitride, boron nitride and aluminum oxide. Carbon nanotube, graphene, nanosheet are surface-treated by introducing functional group chosen from hydroxyl group and carboxyl group on surface. Aluminum nitride, boron nitride and aluminum oxide are surface-treated with titanate-based coupling agent. The polymer resin is chosen from silicone resin, epoxy resin, phenol resin and polyethylene resin. USE - Thermal conductive material is used for electronic packaging. ADVANTAGE - The thermal conductive material has excellent thermal conductivity, toughness, workability, and productivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of thermal conductive material.