▎ 摘　　要

NOVELTY - Low viscosity, low modulus, high thermal conductivity one-component gel comprises 5-30 pts. wt. hydrogen-containing silicone oil, 9-15 pts. wt. vinyl silicone oil, 3-7 pts. wt. silane coupling agent, 8-10 pts. wt. treatment agent, 1-2 pts. wt. hydrosilylation reaction catalyst and 60-80 pts. wt. thermal conductive filler. USE - The gel is used in electronic device i.e. integrated circuit (IC). ADVANTAGE - The gel: has low viscosity and moderate thixotropic property; is more suitable for continuous dispensing mode to operate; saves labor and improves the production efficiency; reduces the use amount of the filler; has excellent extrusion performance, higher heat conductive coefficient, excellent cohesion, higher bearing temperature and more excellent storage condition. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for (1) preparation method of low viscosity, low modulus, high thermal conductivity one-component gel.