• 专利标题:   High-strength graphene heat-conducting gasket in thermal interface material field, has stacking direction of graphene heat-conducting layer is perpendicular to stacking direction of graphene film in any layer of graphene heat-conducting layer.
  • 专利号:   CN116039172-A
  • 发明人:   WANG H, FANG X, SUN A, YANG S, CAO Y
  • 专利权人:   SHENZHEN HFC CO LTD
  • 国际专利分类:   B32B003/14, B32B003/22, B32B037/12, B32B007/12, B32B009/00, B32B009/04, C01B032/194, H05K007/20
  • 专利详细信息:   CN116039172-A 02 May 2023 B32B-009/00 202347 Chinese
  • 申请详细信息:   CN116039172-A CN10007425 04 Jan 2023
  • 优先权号:   CN10007425

▎ 摘  要

NOVELTY - The gasket has at least two layers of graphene heat conducting layer (2) stacked in sequence, where adjacent graphene heat-conducting layer is bonded and fixed by adhesive. The graphene heat-conducting layer has a multilayer graphene film (1) stacked in sequence, where the adjacent described graphene film is bonded by adhesive. The stacking direction of the graphene film in the graphene heat-conducting layer of two adjacent layers is perpendicular to each other and parallel to the same plane. The stacking direction of the graphene heat-conducting layer is perpendicular to the stacking direction of the graphene film in any layer of the graphene heat-conducting layer. The adhesive is multiple combinations of polyurethane adhesive, epoxy resin adhesive, phenolic resin adhesive, acrylic resin adhesive, and adhesive. USE - High-strength graphene heat-conducting gasket in thermal interface material field. ADVANTAGE - The graphene film has good heat conduction effect in the layer direction, using multi-layer graphene film stack to form graphene layer, the interlayer is adhered by adhesive, the high heat-conducting graphene of the heat conducting layer in the graphene film layer in horizontal direction is fully used. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic structural diagram of the High-strength graphene heat-conducting gasket in thermal interface material field. 1Graphene film 2Graphene heat-conducting layer