• 专利标题:   Preparing gasket used for heat conduction and dissipation in electronic device, by mixing binder, two-dimensional heat-conducting filler and other optional ingredients, vacuum defoaming to obtain mixed material, extruding to obtain sheet, and subjecting sheet to drawing, rolling and vulcanizing.
  • 专利号:   CN113334731-A
  • 发明人:   GE X, LI F, LI Z, ZHANG Y, ZHOU B
  • 专利权人:   HANGZHOU FUXI TECHNOLOGY CO LTD
  • 国际专利分类:   B29C035/02, B29C048/00, B29C048/305, B29L007/00, C09K005/14
  • 专利详细信息:   CN113334731-A 03 Sep 2021 B29C-048/305 202186 Pages: 14 Chinese
  • 申请详细信息:   CN113334731-A CN10654547 11 Jun 2021
  • 优先权号:   CN10654547

▎ 摘  要

NOVELTY - Preparing heat-conducting gasket involves: (1) mixing a binder, a two-dimensional heat-conducting filler and other optional ingredients, and vacuum defoaming to obtain a mixed material; (2) extruding the mixed material through a split-type die head to obtain a sheet; and (3) subjecting the sheet to drawing, rolling and vulcanizing. USE - The method is useful for preparing heat-conducting gasket used for heat conduction and heat dissipation in electronic device (all claimed).