▎ 摘　　要

NOVELTY - The invention relates to the technical field of semiconductor, specifically relates to a substrate, a power module and a packaging structure, the substrate comprises: ceramic body, a first copper-clad layer and a second copper-clad layer; the ceramic body is installed between the first copper-clad layer and the second copper-clad layer; and the wall surface of the ceramic body close to the first copper-clad layer is provided with a mounting groove; the mounting groove is provided with a graphene sheet; the embodiment is embedded with graphene sheet in the ceramic main body, so as to effectively improve the radiating capability of the substrate by using the high thermal conductivity of the ceramic material and the graphene sheet material; the heat generated when the module is working can be discharged in time; the thermal resistance of the module is effectively reduced; the working efficiency of the module is improved.