▎ 摘　　要

NOVELTY - Heat resistant high strength polyimide film comprises 40-50 pts. wt. sulfur-containing diamine, 10-35 pts . wt. 2-(4-aminophenyl)-5-aminobenzimidazole, 40-50 pts. wt. 3,3',4,4'-biphenyltetracarboxylic dianhydride, 50-65 pts. wt. 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 2-5 pts. wt. graphene, 1-3 pts . wt. barium titanate, 0.5-2 pts. wt. nano-silica, 2-5 pts. wt. nano-alumina and 0.5-2 pts . wt. nano-titanium dioxide. USE - Used as heat-resistant high-strength polyimide film. ADVANTAGE - The heat-resistant high-strength polyimide film has high heat resistance, high mechanical strength and small thermal expansion coefficient.