▎ 摘　　要

NOVELTY - The plate has an N-type semiconductor (3) connected with a P-type semiconductor (4) that is connected with a metal conductor (5). A power supply unit (6) is connected with the conductor. The N-type semiconductor and the P-type semiconductor are connected with a graphene unit (7). A heat radiator (2) is formed with a heat radiator graphene layer. A plate cold side (1) is formed with a graphite heat-conducting layer (11). The power supply unit is connected with a current regulating unit. Graphite purity of the N-type semiconductor is greater than purity of the P-type semiconductor. USE - Semiconductor heating plate. ADVANTAGE - The plate avoids burning problem so as to ensure normal work. DESCRIPTION OF DRAWING(S) - The drawing shows a partial sectional view of a semiconductor heating plate. Plate cold side (1) Heat radiator (2) N-type semiconductor (3) P-type semiconductor (4) Metal conductor (5) Power supply unit (6) Graphene unit (7) Graphite heat-conducting layer (11)