▎ 摘　　要

NOVELTY - The electrical interconnect structure has a metallic overlay portion that connects peripheral edges (104) of the graphene elements (100) with each other. The graphene elements are conductively isotropic with respect to X, Y, and Z axes. The graphene elements are doped with bromine. The graphene elements are positioned on a dielectric substrate (200). The metallic overlay portion is made of copper, aluminum, gold, palladium, or silver. USE - High-conductivity electrical interconnect structure for electrically interconnecting electrical components. ADVANTAGE - The highly-conductive structure is formed efficiently and effectively. The conductivity of high-conductivity electrical interconnect structure is improved. The electrical interconnection capability of high-conductivity electrical interconnect structure is improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of forming high-conductivity electrical interconnect structure on substrate. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of the graphene element stacked on substrate. Graphene element (100) Peripheral edge (104) Lateral edge (106) Upper surface (108) Dielectric substrate (200)