▎ 摘　　要

NOVELTY - High-temperature resistant heat-conducting wave absorbing plate comprises 80-120 pts. wt. liquid silicone rubber, 15-20 pts. wt. cross-linking agent, 0.1-0.2 pts. wt. platinum catalyst, 0.06-1 pts. wt. inhibitor, 300-400 pts. wt. heat conducting powder, and 600-700 pts. wt. absorbing powder. USE - Used as high-temperature resistant heat-conducting wave absorbing plate. ADVANTAGE - The absorbing plate inhibits high temperature oxidation behavior; has stable absorbing powder at high temperature. The method through mature rolling process to prepare heat absorbing wave-absorbing plate; has hardness not more than 70 Shore OO, and keeping good rebound resilience, not pulverization, not hardening; improves high temperature resistance of the heat-conducting wave absorbing material, enhances high temperature stability and service life of heat-conducting waveabsorbing material. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacturing the high temperature resistant heat-conducting wave-absorbing plate, comprising (i) coating the absorbing powder by silica shell coating process, suppressing the high temperature oxidation behavior of the absorbing material by the silica shell; (ii) taking carbonyl iron powder or permalloy powder and absolute ethanol to prepare the materials, and dissolving carbonyl iron powder or permalloy powder in absolute ethanol by weight percentage 3:1, and placing in planetary mixer, stirring under the speed of 30 revolutions/minutes, stirring and mixing for 30 minutes to obtain A material; (iii) dissolving ethyl orthosilicate in absolute ethanol by weight percentage 1:1, stirring and mixing for 10 minutes under a magnetic stirrer to obtain material B; (iv) mixing hydrochloric acid and deionized water at 1:8 by weight under a magnetic stirrer, at a stirring speed of 100 revolutions/minute, stirring and mixing for 10 minutes to obtain material C; (v) mixing material A, material B in a planetary mixer at a weight percentage of 2:1, stirring and mixing for 30 minutes to obtain material D; (vi) adding C material dropwise to D material, during the dropwise addition of C material, continuously mixing and stirring C material and D material, and dropping rate is 5g/minutes, continuously stirring at a stirring speed of 20 revolutions/minute, until the material becomes gel-like, and allowing to stand for 3 days to obtain E material; (vii) washing the E material three times and drying for 16 hours to obtain a silica-coated wave absorbing filler; and (viii) calendering, molding, taking out or pouring out or pouring D and E materials into a pre-prepared container or forming mold to shape and shape. DESCRIPTION OF DRAWING(S) - The drawing shows a high temperature-resistant heat-conducting wave-absorbing composite material and a manufacturing method of the flow diagram. (Drawing includes non-English language text).