▎ 摘　　要

NOVELTY - The packaging unit has a substrate (1) that is made of a material capable of manufacturing semiconductor devices. A material layer is laminated on one side of the substrate for forming semiconductor devices, and a flow channel through which the cooling fluid flows is formed on the other side of the substrate to enable direct cooling of the semiconductor device using a cooling fluid. A thin film structure (4) is made of a polymer synthetic resin material that constitutes a dry film resist (DFR) film and one of graphene, carbon nanotubes, gold nanoparticles, and silver nanoparticles to increase thermal conductivity. The thin film structure is provided with a pattern portion (42) that is formed in a partitioning portion of the fluid movement area to include the same height as an edge portion (41) and closely adhere to the flow channel of the substrate. The pattern portion is provided with a zigzag pattern structure. USE - Packaging unit for directly cooling semiconductor device. ADVANTAGE - The cooling fluid is guided to the flow channel side of the substrate at a position corresponding to the partitioning portion of the heat sink unit without loss. The simplification of the structure and slimming of the packaging unit are enabled. The cooling efficiency of the semiconductor device is maximized. DESCRIPTION OF DRAWING(S) - The drawing shows an exploded perspective view of the packaging unit for directly cooling semiconductor device. 1Substrate 2Packaging block 4Thin film structure 41Edge portion 42Pattern portion