▎ 摘　　要

NOVELTY - A low-density high-conductivity potting adhesive comprises 25-50 %mass silicone polymer, 30-60 %mass thermally conductive powder, 0.5-5 %mass low density powder and 5-15 %mass additive. The low density powder is selected from hollow silica, aerogel, porous silicon low density powder and/or graphene powder. USE - Low-density high-conductivity potting adhesive (claimed). ADVANTAGE - The lightweight, safe and reliable low-density high-conductivity potting adhesive is prepared by simple process.