▎ 摘　　要

NOVELTY - Monolithic heat sink comprises: hybrid composite structured dense base (1) comprising aluminum alloy, graphene (4) in plate form, and copper (3) in cylindrical form, that provides increased heat conduction, and that has a density of 90-100%; and at least one foamed fin (5) that provides increased heat transfer, that has a dense cell wall (15) comprising aluminum alloy, graphene in plate form, and copper in cylindrical form, and that has a hybrid composite structure and porosity of 50-90%. USE - The heat sink is useful in: led chips for electronic devices, electronic packaging systems, electronic coolers and thermoelectric systems; and electronic systems required in defense industry, aviation, automotive, telecommunication, computer technologies and biomedical devices. ADVANTAGE - The heat sink: increases the interactive surface area of the porous structures inside the fins, thus increasing the convective heat transfer and performance by means of the fact that the heat sink has fins in the form of foam and the heat sink is produced as monolithic; increases the convection and thermal conductivity by means of being a hybrid form comprising graphene and copper together, where the thermal conductivity of graphene and copper is quite high, and both increase the conductive heat transfer, and graphene and copper are made into a high-density base for fast and efficient heat transfer; increases the heat transfer even more by using the cylindrical and plate form in the structure, other than the powder form of graphene and copper; and eliminates too high or low pore size causes flow and thermal resistance problems, heat transfer problems, and therefore efficiency losses, thus increasing the cooling efficiency. DESCRIPTION OF DRAWING(S) - The figure shows a schematic view of hybrid composite heat sink. 1Hybrid composite structured dense base 3Copper 4Graphene 5Foamed fin 15Dense cell wall