▎ 摘　　要

NOVELTY - Thermal conductive graphene-based epoxy resin adhesive comprises (in wt.%) graphene-based epoxy resin (40-60), reaction diluent (2-10), curing agent (3-7), enhancer (1-3), coupling agent (0.5-1.5) and high thermal conductivity fillers (20-40). USE - The thermal conductive graphene-based epoxy resin adhesive is useful for thermal conductive sealing of high-end fine electronic and electromechanical component. ADVANTAGE - The adhesive has high thermal conductivity, and low density. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the thermal conductive graphene-based epoxy resin adhesive, comprising preparing graphene-based epoxy resin, adding sequentially graphene-based epoxy resin (40-60%), reaction diluent (2-10%), curing agent (3-7%), enhancer (1-3%), coupling agent (0.5-1.5%) and high thermal conductivity fillers (20-40%) into double planetary power mixer and stirring mechanically for 1-2 hours under conditions of -0.08 to -0.1 MPa, and autorotation speed of 300-1000 revolutions/minute, and then stirring mechanically for 1-2 hours under the condition of rotating speed of 5-15 revolutions/minute, discharging, and storing at low temperature of 0-8 degrees C.