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  • 专利标题:   Chip packaging unit has graphene coating which is disposed on heat dissipation paste cured layer.
  • 专利号:   TW767695-B1, US2022367309-A1, TW202245166-A
  • 发明人:   YEN H, HUANG H, HU Y
  • 专利权人:   RICHTEK TECHNOLOGY CORP, RICHTEK TECHNOLOGY CORP
  • 国际专利分类:   H01L023/29, H01L023/373, H01L021/56, H01L023/31, H01L023/34
  • 专利详细信息:   TW767695-B1 11 Jun 2022 H01L-023/29 202264 Pages: 25 Chinese
  • 申请详细信息:   TW767695-B1 TW116946 11 May 2021
  • 优先权号:   TW116946

▎ 摘　　要

NOVELTY - The present invention discloses a chip package unit, which includes: a substrate; at least one chip, disposed on the substrate; a package material, enclosing the substrate and the chip; and at least one curing layer of thermal paste, formed by curing the thermal paste on a top of the package material or a back side of the chip in a distribution pattern.