▎ 摘　　要

NOVELTY - Solid-liquid coupling type multilayer thermal interface material comprises a liquid material layer and a solid material layer. The upper and lower surfaces of the solid material layer adopt grid structure design and contact with the liquid material layer. The liquid material layer comprises a composite material formed by mixing gallium-based N-element alloy and micro-nano-filled particles. The gallium-based N-element alloy comprises gallium indium alloy, gallium-indium-tin alloy and/or gallium-indium-tin-zinc alloy, the micro-nano-filled particle comprises silver powder, copper powder, zinc powder, bismuth powder, silver-coated copper; aluminum nitride, boron nitride, graphene, carbon nano tube, diamond in atleast one of N is an integer greater than or equal to 2. The solid material layer comprises copper, silver, indium, gallium, tin, bismuth and/or zinc. USE - Used as solid-liquid coupling type multilayer thermal interface material. ADVANTAGE - The material has high thermal conductivity and low contact thermal resistance, and its heat dissipation effect is much higher than that of ordinary thermal conductive silicone grease, which can meet the ultra-high heat dissipation requirements of high-power electronic equipment. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparation method of a multi-layer thermal interface material, comprising removing the oxide film on the surface of the micro-nano filling particles, obtaining pure micro-nano filling particles, fully mixing the pure micro-nano filling particles with the gallium-based N-element alloy to obtain liquid composite material, where the solid material high temperature hot pressing into uniform sheet with grid structure and cutting into the preset size to obtain the solid material layer, the upper and lower surfaces of the solid material layer are uniformly coated with the liquid composite material by screen printing method to form a liquid material layer, the gallium-based N-element alloy is gallium indiumalloy, gallium-indium-tin alloy and/or gallium-indium-tin-zinc alloy, the micro-nano-filled particle comprises silver powder, copper powder, zinc powder, bismuth powder, silver copper, aluminum nitride, boron nitride, graphene, carbon nano tube; at least one of the diamond, N is an integer greater than or equal to 2, the solid material layer is copper, silver, indium, gallium, tin, bismuth and/or zinc. DESCRIPTION OF DRAWING(S) - The drawing shows a schematically shows a cross-sectional view of the multilayer thermal interface material structure and structure view of the solid material surface.