▎ 摘　　要

NOVELTY - Manufacturing a component carrier (100), involves providing a stack comprising electrically conductive layer structure (104) and/or electrically insulating layer structures (106), embedding a component (108) in the stack, creating, in particular drilling, a blind hole (110) in stack towards the embedded component, and extending the blind hole by etching to expose a surface portion (112) of embedded component. USE - Method for manufacturing a component carrier, e.g. electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, a light guiding element, an optical element, a bridge, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element and a logic chip (claimed). ADVANTAGE - The method enables assembling the component of a component carrier in a simple and compact way while reliably ensuring a proper functionality of the component. The method allows the component carriers to be mechanically robust and electrically reliable so as to be operable even under harsh conditions. The component carrier can be manufactured with high quality and low effort, as well as with a compact configuration in view of the embedding. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a component carrier. Component carrier (100) Electrically conductive layer structure (104) Electrically insulating layer structures (106) Component (108) Blind hole (110) Surface portion (112)