• 专利标题:   Preparation of structured graphene by depositing silicon dioxide layer on silicon carbide wafer surface, scribing graphics window, reacting carbon tetrachloride with naked silicon carbide, putting wafer on copper film, and annealing.
  • 专利号:   CN102674330-A
  • 发明人:   DENG P, GUO H, LEI T, ZHANG Y, ZHANG K, ZHANG F
  • 专利权人:   UNIV XIDIAN
  • 国际专利分类:   C01B031/04, H01L021/02
  • 专利详细信息:   CN102674330-A 19 Sep 2012 C01B-031/04 201338 Pages: 8 Chinese
  • 申请详细信息:   CN102674330-A CN10160190 22 May 2012
  • 优先权号:   CN10160190

▎ 摘  要

NOVELTY - Preparation of structured graphene based copper (Cu) film annealing on silicon carbide (SiC) substrate includes cleaning SiC wafer; depositing a layer of silicon dioxide (SiO2) on the surface of SiC wafer; scribing graphics window on SiO2; putting the windowed wafer in quartz tube; reacting carbon tetrachloride (CCl4) with naked SiC to produce double-layer carbon film; putting the produced double-layer carbon film sample wafer in buffered hydrofluoric acid solution to remove SiO2, which is outside of the window; putting the sample wafer on Cu film; putting in argon; and annealing. USE - Preparation of structured graphene i.e. double-layer structured graphene (claimed) used for making microelectronic devices. ADVANTAGE - The method is simple; has high safety; and provides double-layer structured graphene having smooth surface, good continuity, and low porosity. DETAILED DESCRIPTION - Preparation of structured graphene based Cu film annealing on SiC substrate comprises: (A) cleaning SiC sample wafer to remove the surface pollutant; (B) depositing a layer of SiO2 having 0.4-1.2 mu m thickness by plasma enhanced chemical vapor deposition (PECVD) on the surface of cleaned SiC sample wafer with plasma as the mask; (C) coating a layer of photoresist on the surface of the mask; scribing a window, which is of the same shape of desired device substrate, on the mask; exposing SiC; and forming structured graphics; (D) putting the windowed sample wafer in a quartz tube; connecting well with each device; and heating the quartz tube at 800-1000 degrees C; (E) heating a flask with three-opening loaded with CCl4 liquid at 60-80 degrees C; charging argon to the flask with three-opening; making the CCl4 steam enter into the quartz tube with argon to make the CCl4 react with naked SiC for 30-120 minutes; and producing the double-layer carbon film; (F) putting the produced double-layer carbon film sample wafer in buffered hydrofluoric acid solution to remove SiO2, which is outside of the window; and (G) putting the sample wafer, on Cu film and putting in argon together; annealing for 15-25 minutes at 900-1100 degrees C; making the double-layer carbon film constitute the double-layer structured graphene at the window; and taking out the Cu film from the sample wafer of the double-layer structured graphene.