▎ 摘　　要

NOVELTY - The method involves sleeving a rib on a heat column of a bottom plate to form an intermediate assembly. Graphene is coated on the intermediate component. The middle component is coated with the graphene coating, so that the rib is fixedly assembled with the bottom plate. The bottom plate is fixed with the rib to form a radiator. USE - Method for packaging a radiator of a processor is used in electronic equipment (claimed). ADVANTAGE - The packaging method of the radiator of the processor not only simplifies the process, but also reduces the heat resistance of the fin and heat column contact strengthens the radiating performance, so that the radiator under the same radiating area, the radiator has a stronger radiating ability. The heat column of the bottom plate and the fin are fixedly assembled to form a radiator, which avoids the chromium plating treatment and hot column tinning treatment of the fins, and also avoids the welding of fin and the heat column by hot melting, because one of the four graphene physical properties is high thermal conductivity. The fin and bottom plate are coated with a layer graphene coating, which reduces the discharge of heavy metal. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) a radiator of a processor; (2) a processor; (3) electronic equipment. DESCRIPTION OF DRAWING(S) - The drawing shows a flow chart of a method for packaging method of radiator of processor of electronic equipment.