• 专利标题:   Conductivity floor material for graphene integrated indoor heating of indoor floor panel utilized during construction of building, has stiffening layer for beefing up upper portion of heat conductive layer.
  • 专利号:   KR1694067-B1
  • 发明人:   BONG S P, DONG K K
  • 专利权人:   KANG K S, KANG M H, PARK B S, KIM D K
  • 国际专利分类:   B32B009/00, E04B005/02, E04F015/18
  • 专利详细信息:   KR1694067-B1 06 Jan 2017 E04F-015/18 201709 Pages: 15
  • 申请详细信息:   KR1694067-B1 KR145068 19 Oct 2015
  • 优先权号:   KR145068

▎ 摘  要

NOVELTY - The material (1) has a heat conductive layer (200) formed with high thermal conductivity material. Graphene is formed in an upper part of a base layer (100) that is provided with a bottommost layer. A stiffening layer (300) beefs up an upper portion of the heat conductive layer. A thermal conduction coating layer (400) coats the upper portion of the stiffening layer on finishing with 10-15 wt.% and 20-30 wt.% of water organize, 3-7 wt.% of mineral adhesion material, 30-40 wt.% of granite soil aggregate, 3-6 wt.% limestone powder, 10-20 wt.% cement and 100 wt.% slag powder of the base layer. USE - Conductivity floor material for graphene integrated indoor heating of an indoor floor panel utilized during construction of a building. ADVANTAGE - The material improves heat storage effect in the indoor floor panel according to the thermal conductive enhancement, and enhances application and heat insulation nature. The heat conductive layer is formed during production process of flooring material with the graphene so as to enhance thermal conductance and heating efficiency. DETAILED DESCRIPTION - The stiffening layer is formed with 50-60 wt.% of yellow soil powder, 10-15 wt.% of clay, 10-15 wt.% of paper mulberry gruel, 10-20 wt.% of water and 200-300 mesh. An INDEPENDENT CLAIM is also included for a method for manufacturing conductivity flooring material for graphene integrated indoor heating. DESCRIPTION OF DRAWING(S) - The drawing shows a cross sectional view of a conductivity floor material. Conductivity floor material (1) Base layer (100) Heat conductive layer (200) Stiffening layer (300) Thermal conduction coating layer (400)