▎ 摘　　要

NOVELTY - Manufacture (100) of semiconductor device involves forming a carbon buffer layer on a substrate (110) and a graphene layer on the carbon buffer layer, and removing the graphene layer so as to expose the carbon buffer layer and form a fabrication platform. USE - Manufacture of semiconductor device (claimed). Uses include but are not limited to rack-mounted computer, desktop computer, laptop computer, speakers, display screens for visual presentation of output, computer memory, floppy disc, compact disc, optical disc, magnetic tape, flash memories, and tablet computer. ADVANTAGE - The method is economical by reusing the substrate, refurbishing the minimal substrate after releasing layer, fast releasing rate, transferring the released group (III)-N-semiconductor to the substrate, and controlling of release thickness. DESCRIPTION OF DRAWING(S) - The drawing shows schematic view illustrating method of fabricating semiconductor device. Fabricating method (100) Substrate (110) Surface (115)