▎ 摘　　要

NOVELTY - The structure has a first coplanar waveguide fixed on a first substrate. A second coplanar waveguide is located on a second substrate, where structure of the first coplanar waveguide and the first coplanar waveguide are same. Multiple two-dimensional hetero-structures are utilized for uniformly covering and connecting the first coplanar waveguide and the second coplanar waveguide, such that multiple conductors are correspondingly connected one by one. Each two-dimensional heterogeneous structure is provided with a two-dimensional conductive material layer for transmitting signal. A two-dimensional dielectric material layer is located at a lower side of the two-dimensional conductive material layer, where a structure of the first coplanar waveguide is ground-signal (GS) structure, signal-ground (SG) structure or ground-signal-ground (GSG) structure, and the material layer is made of graphene and black scale material. USE - Low loss coplanar waveguide bonding structure for use in a semiconductor field. ADVANTAGE - The structure utilizes characteristics conductivity of reduced skin effect loss, so that two-dimensional conductive material is uniformly covered on a to-be-connected conductor surface, thus improving uniformity of a bonding section transmission line, reducing high-frequency transmission reflection, and ensuring transmission bandwidth, and avoids formation of a welding point between the two-dimensional conductive material and a metal electrode, thus avoiding damage to the metal electrode. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing a low loss coplanar waveguide bonding structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a low loss coplanar waveguide bonding structure. 11Signal conductor 12Ground conductor 13Ground conductor 21Signal conductor 22Ground conductor 23Ground conductor 31Two-dimensional conductive material layer 32Two-dimensional dielectric material layer