• 专利标题:   Preparing polymerized graphene hybrid modified polyamic acid resin preparing polyimide film product, by adding graphene to nitrogen-dimethylformamide solution, dispersing, adding isopropanol pinacol borate and adding diamine and dianhydride.
  • 专利号:   CN110396193-A
  • 发明人:   WANG Y, XU W, YIN A, QI X, JIANG X, LI J, XU P, GAO S
  • 专利权人:   JIANGSU YABAO INSULATION MATERIALS CO
  • 国际专利分类:   C08G073/10, C08J005/18, C08K003/04, C08K009/04, C08L079/08
  • 专利详细信息:   CN110396193-A 01 Nov 2019 C08G-073/10 201989 Pages: 7 Chinese
  • 申请详细信息:   CN110396193-A CN10830471 04 Sep 2019
  • 优先权号:   CN10830471

▎ 摘  要

NOVELTY - Method for preparing a polymerized graphene hybrid modified polyamic acid resin, involves (i) adding graphene to a nitrogen solution and nitrogen-dimethylformamide solution, and ultrasonically dispersing to prepare 1-4 wt.% graphene solution, and adding 2-5 wt.% isopropanol pinacol borate to prepare graphene dispersion, (iii) adding diamine and dianhydride to the graphene dispersion prepared in step (i) in an equimolar ratio, and stirring for 4-8 hours to obtain the polymerized graphene hybrid modified polyamic acid resin solution having a solute concentration of 18 wt.%. USE - The method is useful for preparing polymerized graphene hybrid modified polyamic acid resin for preparing polyimide film products having high thermal conductivity. ADVANTAGE - The method enables preparation of polymerized graphene hybrid modified polyamic acid resin with highly increased thermal conductivity and mechanical properties of the material. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the use of the polyamic acid resin for preparing a polyimide film products having high thermal conductivity.