• 专利标题:   Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.
  • 专利号:   CN112225929-A, WO2022086402-A1
  • 发明人:   WANG N
  • 专利权人:   WANG N, SHT SMART HIGHTECH AB, SUZHOU NANYI SCI TECHNOLOGY CO LTD
  • 国际专利分类:   C08J005/18, C08K003/04, C08L063/00, C08L083/04, C08L091/06, C09K005/14, H05K007/20, B29C070/00, C01B032/182, H01L029/16
  • 专利详细信息:   CN112225929-A 15 Jan 2021 C08J-005/18 202114 Pages: 10 Chinese
  • 申请详细信息:   CN112225929-A CN11116087 19 Oct 2020
  • 优先权号:   CN11116087

▎ 摘  要

NOVELTY - Preparation of graphene reinforced thermal conductive composite film involves performing punching method to pass through the closed bubble structure of low-density graphene film to form graphene film with closed bubble structure without calendering to form openings, coating polymer with adjusted fluidity on surface of the graphene film, injecting polymer into graphene film along the drilled small holes to fill the original bubble structure and curing polymer structure. USE - Preparation of graphene reinforced thermal conductive composite film used as substrate material, heat dissipation material and packaging material for electronic product (all claimed). ADVANTAGE - The preparation method is simple and easy, and produces product with high strength and thermal conductivity, and excellent mechanical property, and is suitable for large-scale automated production. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the graphene reinforced thermal conductive composite film, which has thermal conductivity of 50-1500 W/mK, density of 0.1-2 g/cm3, peel strength of 50-1000 kPa, tensile strength of 10-500 MPa, compression rate of 10-80% under external force of 400 kPa and elongation rate of 5-80% under external force of 50 MPa.