• 专利标题:   Heat conducting gasket comprises heat conducting film and adhesive layer, preferably other heat conducting filler, where the heat conducting film has multi holes passing through upper and lower surfaces of heat conducting film.
  • 专利号:   CN113183544-A
  • 发明人:   GE X, LI F, ZHOU B
  • 专利权人:   HANGZHOU FUXI TECHNOLOGY CO LTD
  • 国际专利分类:   B32B003/24, B32B033/00, B32B037/10, B32B037/12, B32B038/00, B32B038/04, B32B007/12, B32B009/00, C09J011/04, H05K007/20
  • 专利详细信息:   CN113183544-A 30 Jul 2021 B32B-003/24 202168 Pages: 13 Chinese
  • 申请详细信息:   CN113183544-A CN10436502 22 Apr 2021
  • 优先权号:   CN10436502

▎ 摘  要

NOVELTY - Heat conducting gasket comprises a heat conducting film and an adhesive layer, preferably other heat conducting filler, where the heat conducting film has multi holes passing through the upper and lower surfaces of the heat conducting film and multi holes are filled with adhesive. USE - Used as heat conducting gasket. ADVANTAGE - The gasket: uses different layers of adhesive that can be connected through multi holes, can form a continuous structure, wrap the thermal conductive film on a microscopic scale; uses adhesive, which can be strongly combined with the thermal film without surface coating, and avoids the problem of delamination of the heat conducting film itself. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) preparing the heat-conducting gasket, comprising (i) forming multi holes passing through the upper and lower surfaces of the heat conducting film on the heat conducting film, (ii) laminating an adhesive layer on the heat conducting film formed in the step (i), then laminating the heat conducting film formed in the step (i) on the adhesive layer, repeating the layer-by-layer alternating laminating process to form a stacked body, (iii) pressing the stacked body obtained in the step (ii) to form, and performing vulcanization treatment, (iv) slicing the shaped body obtained in the step (iii) along the direction vertical to the plane of the heat conducting film, and (v) subjecting the obtained slice for secondary vulcanization treatment, and performing surface polishing treatment; and (2) combining a membrane structure with a polymer material, comprising (1) forming multi holes passing through the upper and lower surfaces of the film structure on the film structure, (2) laminating a polymer material on the film structure formed in the step (1), where the polymer material at least covers the multi holes, and (3) continuously laminating the film structure or other material; and (3) electronic device, comprising a heat source, a radiating component, and an insulating heat-conducting gasket clamped between the heat source and the radiating component, where the heat-conducting gasket is the insulating heat-conducting gasket.