• 专利标题:   Method for preparing anisotropic conductive adhesive film used in the field of microelectronic packaging, involves coating microspheres with nanocarbon material as conductive ball and frame adhesive system as substrate, emulsification of surfactant remained on the surface of the nanocarbon material.
  • 专利号:   CN113621331-A
  • 发明人:   CHENG H, REN W, LIU H, DU J
  • 专利权人:   INST METAL RES CHINESE ACAD SCI
  • 国际专利分类:   C09J011/08, C09J163/00, C09J007/10, C09J007/30, C09J009/02, H01B005/16
  • 专利详细信息:   CN113621331-A 09 Nov 2021 C09J-163/00 202209 Chinese
  • 申请详细信息:   CN113621331-A CN10844643 26 Jul 2021
  • 优先权号:   CN10844643

▎ 摘  要

NOVELTY - Method for preparing anisotropic conductive adhesive film coating nano-carbon material and frame glue system as the matrix, utilizing the emulsification effect of the surfactant remaining on the surface of the nano-carbon material to promote the uniform dispersion of the conductive ball in the frame glue system, adding conductive balls to the frame glue system in a small number of times, after defoaming and forming into a film, anisotropic conductive adhesive film is obtained by hot pressing and curing. Specifically the following step involves adding diluent, curing agent, accelerator and/or other auxiliaries with epoxy resin as the base glue, and mixing uniformly to obtain a frame glue system. Dispersing nano-carbon material in the aqueous solution with a surfactant and coating it on the surface of the microsphere to obtain the nano-carbon material conductive ball, controling the cleaning conditions so that part of the surfactant remains on the surface of the conductive ball. USE - Method for preparing anisotropic conductive adhesive film used in the field of microelectronic packaging (Claimed). ADVANTAGE - Anisotropic conductive adhesive film utilizes nano carbon material coated microspheres as conductive particles, thereby solving the defects of complex preparation process, high price, environmental pollution and the like of the plated metal conductive ball. Process of preparing the anisotropic conductive adhesive film, dispersing nano carbon material conductive balls uniformly in the adhesive frame system due to the emulsification effect of the residual surfactant. Adding small quantity of the conductive balls for multiple times, so that the uniformity and the density of the conductive balls accurately controlled, the performance of a conductive adhesive film is regulated and controlled, and the problem that the part of the conductive layer added for one time falls off due to uneven stress is solved. Coating the nano carbon material on the surface of the microsphere in a layer-by-layer coating winding mode and the like, and has excellent flexibility, so that the anisotropic conductive adhesive film prepared by using the nano carbon material coated microsphere as a conductive particle has better pressure resistance during hot-press packaging. The anisotropic conductive adhesive film has the characteristics of controllable thickness, uniform dispersion of conductive balls, adjustable density and good cohesiveness. DETAILED DESCRIPTION - Method for preparing anisotropic conductive adhesive film coating nano-carbon material and frame glue system as the matrix, utilizing the emulsification effect of the surfactant remaining on the surface of the nano-carbon material to promote the uniform dispersion of the conductive ball in the frame glue system, adding conductive balls to the frame glue system in a small number of times, after defoaming and forming into a film, anisotropic conductive adhesive film is obtained by hot pressing and curing. Specifically the following step involves adding diluent, curing agent, accelerator and/or other auxiliaries with epoxy resin as the base glue, and mixing uniformly to obtain a frame glue system. Dispersing nano-carbon material in the aqueous solution with a surfactant and coating it on the surface of the microsphere to obtain the nano-carbon material conductive ball, controling the cleaning conditions so that part of the surfactant remains on the surface of the conductive ball. Adding nano-carbon material conductive balls to the frame glue system by a small number of times, and performing mechanical mixing at the same time to make it evenly dispersed in the frame glue system. After the defoaming treatment, film is formed, and curing by heat and pressure to obtain an anisotropic conductive adhesive film with insulation in the X and Y directions and conduction in the Z direction.