▎ 摘　　要

NOVELTY - The application relates to the technical field of circuit board, and claims a high TG heat-resistant circuit board, comprising a circuit substrate, the lower end surface of the circuit substrate is coated with insulating resin glue material, the inner part of the insulating resin glue material is filled with multiple heat conducting aluminium particles, the lower end of the insulating resin glue material is fixedly adhered with graphene heat conducting bottom layer . The application can effectively improve the heat-resistant performance of the circuit substrate by enhancing the natural heat radiation conduction, the TG value of the circuit substrate is high, and the use effect is good.