• 专利标题:   High thermal conductivity heat-resistant circuit board, has insulating resin glue material whose inner part is filled with heat conducting aluminum particles, where lower end of resin material is fixedly adhered with heat graphene bottom layer.
  • 专利号:   CN219068468-U
  • 发明人:   ZHANG C, HUANG Z, ZHU Y
  • 专利权人:   GUANGZHOU ZHIXIN ELECTRONICS CO LTD
  • 国际专利分类:   H05K001/02
  • 专利详细信息:   CN219068468-U 23 May 2023 H05K-001/02 202346 Chinese
  • 申请详细信息:   CN219068468-U CN23207486 30 Nov 2022
  • 优先权号:   CN23207486

▎ 摘  要

NOVELTY - The application relates to the technical field of circuit board, and claims a high TG heat-resistant circuit board, comprising a circuit substrate, the lower end surface of the circuit substrate is coated with insulating resin glue material, the inner part of the insulating resin glue material is filled with multiple heat conducting aluminium particles, the lower end of the insulating resin glue material is fixedly adhered with graphene heat conducting bottom layer . The application can effectively improve the heat-resistant performance of the circuit substrate by enhancing the natural heat radiation conduction, the TG value of the circuit substrate is high, and the use effect is good.