▎ 摘　　要

NOVELTY - Preparing high thermal conductivity micro-device comprises customizing three-dimensional (3D) printing model according to the device size and microstructure, importing the 3D printing model into the 3D printer, and setting the printing parameters. The 3D printing paste is added to the 3D printer for printing to obtain a thermally conductive device model. The thermally conductive device model is placed under an ultraviolet lamp to carry out photocuring reaction for 10-60 minutes. The thermally conductive device model is dried at room temperature for 24 hours. The heat-conducting device model is put into a hydrothermal reactor for hydrothermal reaction, and dried at room temperature. The thermally conductive device model is immersed into a polymer solution for dipping treatment for 12-24 hours, and then taken out and dried the polymer on the surface to obtain the thermally conductive device. USE - Method for preparing high thermal conductivity micro-device. ADVANTAGE - The method prepares the high thermal conductivity micro-device in a simple, cost-effective and eco-friendly manner.