▎ 摘　　要

NOVELTY - Manufacturing a spacer-graphene heat-spreader in electronic power devices, preferably laser diodes, comprises: depositing on the radiator of the electronic power device, and preferably, on the semiconductor laser cooler a suspension comprising 3-20 wt.% graphene nanoplatelets in Butyl carbitol acetate (RTM: 2-(2-n-Butoxy ethoxy)ethyl acetate) until a layer of 20-200 mu m thickness is obtained; drying the obtained layer at room temperature in air for 10-20 minutes; and drying the obtained layer in a tunnel dryer at 120 degrees C for 10-20 minutes. USE - The method is useful for manufacturing a spacer-graphene heat-spreader in electronic power devices, preferably laser diodes. ADVANTAGE - The method utilizes the graphene suspension under the indium solder that not only prevents the deterioration of diode parameters, but, in pulsed operation, reduces the threshold current and improves the efficiency such as increase in the slope of light-current characteristics, thus facilitating good evacuation of heat from the chip area and minimizing stresses introduced by the assembly process.