• 专利标题:   Method for manufacturing graphene field effect transistor, involves providing silicon substrate, forming insulating layer on silicon substrate, followed by forming leakage electrode on insulation layer, and forming graphene-based channel.
  • 专利号:   CN105895704-A, CN105895704-B
  • 发明人:   JIN Z, PENG S, ZHANG D, WANG S, SHI J, MAO D
  • 专利权人:   INST MICROELECTRONICS CHINESE ACAD SCI, INST MICROELECTRONICS CHINESE ACAD SCI
  • 国际专利分类:   H01L021/336, H01L029/10, H01L029/16, H01L029/78
  • 专利详细信息:   CN105895704-A 24 Aug 2016 H01L-029/78 201663 Pages: 7 Chinese
  • 申请详细信息:   CN105895704-A CN10306295 10 May 2016
  • 优先权号:   CN10306295

▎ 摘  要

NOVELTY - A graphene field effect transistor manufacturing method involves providing a silicon substrate, forming an insulating layer on the silicon substrate and prepared back contact source, forming leakage electrode on the insulation layer, transferring graphene form the source, providing a leakage pattern to form a suspension of graphene channel, patterning graphene channel, preparing graphene on contact source and leakage electrode, and forming graphene-based channel material on dual-gate field-effect transistor in dual contact air gap, where the graphene is gate dielectric and gate electrode. USE - Method for manufacturing graphene field effect transistor. ADVANTAGE - The method enables manufacturing graphene field effect transistor with reduced contact resistance between metal and graphene and increased mobility of graphene.