• 专利标题:   Heat dissipation structure for integrated chip based on film-shaped artificial graphite sheet, comprises graphene heat conduction layer filled in engineering plastic carrier whose top is hot-pressed with sheet metal gasket layer coated with corrosion-resistant coating.
  • 专利号:   CN114801357-A
  • 发明人:   TAO Y, CHEN L, JIANG W, SHU G, GUO H, YANG Y
  • 专利权人:   ANHUI TANHUA NEW MATERIAL TECHNOLOGY CO
  • 国际专利分类:   B32B015/00, B32B015/08, B32B027/28, B32B009/00, B32B009/04, H01L023/367, H01L023/373
  • 专利详细信息:   CN114801357-A 29 Jul 2022 B32B-009/00 202278 Chinese
  • 申请详细信息:   CN114801357-A CN10457695 28 Apr 2022
  • 优先权号:   CN10457695

▎ 摘  要

NOVELTY - A heat dissipation structure comprises engineering plastic carrier and graphene heat conduction layer filled in the plastic carrier. The top of the plastic carrier is hot-pressed with sheet metal gasket layer, and outer surface of the metal gasket layer is coated with corrosion-resistant coating. USE - Heat dissipation structure for integrated chip based on film-shaped artificial graphite sheet. ADVANTAGE - The heat dissipation structure has excellent structure strength and toughness characteristics of engineering plastics, and ensures excellent heat-sinking capability. The heat is directly transferred to the graphene heat conduction layer through the metal gasket layer, reduces the conversion between different heat conduction medium, and further lead out the heat efficiency.