▎ 摘 要
NOVELTY - A heat dissipation structure comprises engineering plastic carrier and graphene heat conduction layer filled in the plastic carrier. The top of the plastic carrier is hot-pressed with sheet metal gasket layer, and outer surface of the metal gasket layer is coated with corrosion-resistant coating. USE - Heat dissipation structure for integrated chip based on film-shaped artificial graphite sheet. ADVANTAGE - The heat dissipation structure has excellent structure strength and toughness characteristics of engineering plastics, and ensures excellent heat-sinking capability. The heat is directly transferred to the graphene heat conduction layer through the metal gasket layer, reduces the conversion between different heat conduction medium, and further lead out the heat efficiency.