• 专利标题:   Preparing microfluidic chip through nickel composite power casting core by vacuum coating and gold-spraying conduction treating silicon female mold, placing in composite electroform liquid, electroforming, cleaning, and injection molding.
  • 专利号:   CN114536652-A
  • 发明人:   JIANG B, QIANG J, SUN H, WANG Y, WENG C
  • 专利权人:   UNIV CENT SOUTH
  • 国际专利分类:   B29C045/14, C25D001/10, C25D015/00, C25D003/12
  • 专利详细信息:   CN114536652-A 27 May 2022 B29C-045/14 202271 Chinese
  • 申请详细信息:   CN114536652-A CN10170978 23 Feb 2022
  • 优先权号:   CN10170978

▎ 摘  要

NOVELTY - Preparing microfluidic chip through nickel composite power casting core comprises preparing silicon female mold and composite electroform liquid, performing vacuum coating and gold-spraying conducting treatment on silicon female mold, placing in composite electroform liquid to carry out mold core electroforming, cleaning and drying, injection molding, cooling and inventiondemolding, and bonding substrate, and covering. The composite electroform liquid is obtained by dissolving positive ion surfactant in pure nickel electroform solution, adding low surface material, stirring and dispersing by magnetic force. USE - Method for preparing microfluidic chip through nickel composite power casting core. ADVANTAGE - The method can realize high quality by nickel composite electroforming mould core chip moulding preparation large batch, low cost.