▎ 摘　　要

NOVELTY - The method involves: (a) coarsening, sensitizing and activating Polyetheretherketone (Colorless organic polymer thermoplastic) or modified Polyetheretherketone (Colorless organic polymer thermoplastic); where the modified Polyetheretherketone (Colorless organic polymer thermoplastic) is a Polyetheretherketone (Colorless organic polymer thermoplastic) modified with carbon fiber, glass fiber, carbon nanotube and/or graphene; (ii) plating copper on surface of product obtained in step (i) by means of chemical plating to form chemical copper plating layer with thickness of 1-3 microns; (iii) plating copper on surface of chemical copper plating layer by means of electroplating to form electroplating copper layer with thickness of 8-30 microns; and (iv) plating nickel on surface of electroplated copper layer to form nickel layer with thickness of 1-10 microns. USE - Preparation method of surface metal layer used in aerospace, electrical and electronic fields. ADVANTAGE - The surface metal layer has uniform appearance, high conductivity, high temperature resistance, surface welding and electromagnetic shielding product. The method is simple, and is suitable for product with complex structure, has strong operability, and realizes high bonding strength between plating layer and substrate in a wide temperature range environment.