▎ 摘　　要

NOVELTY - Maleimide resin film comprises (a) maleimide (1) ; (b) (meth)acrylate having not less than10C; (c) inorganic particles in an amount of 70-90 vol/% with respect to the whole resin film; and (d) a curing catalyst. USE - The maleimide resin film is useful in a maleimide resin composition and useful as an adhesive resin film having a low dielectric property. ADVANTAGE - The maleimide resin film is highly filled with inorganic particles and has a superior adhesion force. DETAILED DESCRIPTION - Maleimide resin film comprises (a) maleimide of formula (1) ; (b) (meth)acrylate having not less than10C; (c) inorganic particles in an amount of 70-90 vol/% with respect to the whole resin film; and (d) a curing catalyst. A = component independently represents a tetravalent organic group having a cyclic structure(s); B = component independently represents an alkylene group that has not less than6C and at least one aliphatic ring having not less than5C and may contain a hetero atom; Q = component independently represents an arylene group that has not less than6C, and may contain a hetero atom; W = component represents a group represented by B or Q; n = component represents a number of 0-100, m = component represents a number of 0-100. Provided that at least one of n or m is a positive number. An INDEPENDENT CLAIM is included for a maleimide resin composition composing the maleimide resin film further comprising (e) an inorganic solvent, where the composition has a thixotropic ratio of 1-3 at 25degreesC.