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  • 专利标题:   Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.
  • 专利号:   WO2022230970-A1
  • 发明人:   KASUE A
  • 专利权人:   PANASONIC INTELLECTUAL PROPERTY MANAGEME
  • 国际专利分类:   C08K007/06, C08K007/18, C08K009/02, C08L101/00, C08L033/06, C08L063/00, C08L083/04, C09K005/14
  • 专利详细信息:   WO2022230970-A1 03 Nov 2022 C08L-101/00 202297 Pages: 26 Japanese
  • 申请详细信息:   WO2022230970-A1 WOJP019253 28 Apr 2022
  • 优先权号:   JP076772

▎ 摘　　要

NOVELTY - Thermally conductive composition comprises a resin (A), and a carbon-based material (B) whose surface is coated with an inorganic substance. USE - The composition is used in a thermally conductive material (claimed) for electronic devices for printed wiring board, transistors, central processing units, microprocessors, driver integrated circuit chips, and memories. ADVANTAGE - The composition produces thermally conductive material with high thermal conductivity, and has favorable moldability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a thermally conductive material obtained by molding the thermally conductive composition into a film or sheet.