▎ 摘　　要

NOVELTY - The system (100) has a heating integrated circuit (IC) element (120) formed on a printed circuit board (PCB) (110). A carbon material layer (130) is formed on an IC device and a portion of the PCB. A heat spread portion (140) covers a side of the PCB such that a space (145) is formed above the carbon material layer. A refrigerant (150) is embedded in the space between the carbon material layer and the heat spread portions. The carbon material layer is selected from a group consisting of carbon fibers, carbon nanotubes, carbon black, graphene, natural graphite, artificial graphite, expanded graphite and fullerene soot. The organic solvent includes alcohol which is selected from the group consisting of methanol, ethanol, n-propenol, iso-propenol, n-butanol, iso-butanol, t-butanol, t-pentanol, ethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monoethyl ether, styrene, ethyl acetate, toluene, xylene, methyl ethyl ketone and acetone. USE - Cooling system for electronic device (claimed). ADVANTAGE - The system alleviates heat, performance deterioration, and increased heat generated by a CPU, a GPU, and a memory due to improved performance of a heat-generating electronic component. The carbon nanolayer is provided with better thermal and electrical conductivity, so that vaporization heat of the refrigerant is released in all directions to maximize heat dissipation effect, and the vaporized refrigerant absorbs heat quickly, thus performing effective cooling. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the cooling system for electronic device. 100Cooling system 110PCB 120Heating IC element 130Carbon material layer 140Heat spread portion 145Space 150Refrigerant