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  • 专利标题:   Preparation of silver-coated graphene reinforced copper-based electrical contact material, involves mixing silver-plated copper powder and silver-plated graphene, and adding bismuth powder, carrying out ball milling and sintering.
  • 专利号:   CN105950904-A, CN105950904-B
  • 发明人:   DAI W, GENG H, LIU H, XIAO Z, WU X, TENG X
  • 专利权人:   UNIV JINAN, UNIV JINAN
  • 国际专利分类:   C22C001/05, C22C009/00, C23C018/44, H01H001/025, H01H001/027
  • 专利详细信息:   CN105950904-A 21 Sep 2016 C22C-009/00 201675 Pages: 6 Chinese
  • 申请详细信息:   CN105950904-A CN10527507 07 Jul 2016
  • 优先权号:   CN10527507

▎ 摘　　要

NOVELTY - Preparation of silver-coated graphene reinforced copper-based electrical contact material, involves (i) coarsening graphene, carrying out sensitization and activation treatment and carrying out silver-plating, washing, drying, (ii) taking 200 mesh copper-yttrium alloy powder, pretreating, carrying out electroless silver plating process, washing and drying, (iii) mixing silver-plated copper powder and silver-plated graphene, and adding 200 mesh bismuth powder and carrying out ball milling, (iv) sintering the mixed homogeneous powder, maintaining and cooling. USE - Preparation of silver-coated graphene reinforced copper-based electrical contact material (claimed). ADVANTAGE - The of The silver-coated graphene reinforced copper-based electrical contact material has excellent overall performance, excellent conductivity, anti-arc erosion and anti-welding property. DETAILED DESCRIPTION - Preparation of silver-coated graphene reinforced copper-based electrical contact material, involves (i) carrying out chemical silver plating method by coarsening graphene having a layer number of 1 to 10 successively, carrying out sensitization and activation treatment, transferring to a chemical bath and carrying out silver-plating, washing to neutral, then drying in a vacuum drying oven and maintaining, (ii) taking 200 mesh copper-yttrium alloy powder, pretreating to remove the surface oxide layer, carrying out electroless silver plating process for silver plating of copper, washing to neutral and drying in a vacuum oven, and maintaining, (iii) mixing silver-plated copper powder and silver-plated graphene according to the specific composition ratio, and adding 200 mesh bismuth powder with the mixed powder, and carrying out ball milling with ball to material ratio of 5:1-10:1 at a ball mill speed of 50-300 rpm, (iv) placing the mixed homogeneous powder into a mold to be press-formed, sintering in a vacuum atmosphere at 800-1000 degrees C at a pressing pressure of 300-700 MPa, maintaining for 1-2 hours, then cooling and taking out the sample.