▎ 摘　　要

NOVELTY - The substrate has a metal base layer fixed on a base material. A construction film layer is formed with an insulating material. An attachment layer is connected with a graphene metal composite material that is fixed on the construction film layer. A circuit unit is electrically connected with the metal base layer through a groove of the attachment layer. The circuit unit forms a circuit pattern on the construction film layer, where the substrate is made of a metal substrate material. The metal substrate layer is provided with multiple grooves. USE - Electronic component package substrate. ADVANTAGE - The substrate can effectively overcome skin effect, to reduce insertion loss, and reduces dielectric constant and dissipation factor of the insulating material. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of an electronic component package substrate. 2Base material 3Metal base layer 4Film layer 5Attachment layer 61Circuit pattern