• 专利标题:   Preparation of graphene uniform temperature plate used in e.g. electronic device, by stacking sheets of graphene oxide films to obtain graphene oxide layer, separating several layers of graphene oxide layer to obtain stack component, heat treating, graphitizing, and calendering.
  • 专利号:   CN114407447-A
  • 发明人:   HAO Z, GUO W, LV J, LIU Z, CAI J
  • 专利权人:   GUANGDONG MORION NANOTECH CO LTD
  • 国际专利分类:   B32B037/06, B32B038/18, B32B009/00, B32B009/04
  • 专利详细信息:   CN114407447-A 29 Apr 2022 B32B-009/00 202250 Chinese
  • 申请详细信息:   CN114407447-A CN11641873 29 Dec 2021
  • 优先权号:   CN11641873

▎ 摘  要

NOVELTY - Preparation of graphene uniform temperature plate involves: coating and drying graphene oxide slurry, which does not contain binder to obtain a graphene oxide film; stacking several sheets of graphene oxide films to obtain a graphene oxide layer; separating several layers of graphene oxide layers at intervals by using a partition to obtain a stack component with a height set to (H); arranging a stopper above the stack component, where the distance between the lower surface of the stopper and the upper surface of the stack component is 0.5-1.5 H; subjecting the stack component to heat treatment and graphitization to convert the graphene oxide layer into a graphene layer; and calendering. USE - The method is useful for preparing graphene uniform temperature plate used in radiating device and electronic device (all claimed). ADVANTAGE - The method: obtains ultra-thick graphene uniform temperature plate, which has highly directionally arranged graphene, and excellent planar thermal conductivity, and can replace partial functions of heat pipes; solves the technical problem that interlayer bonding force between ultra-thick graphene heat conducting film/plate is insufficient and difficult to manufacture; is simple and cost-effective; and reduces the weight of the radiating component. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the graphene uniform temperature plate, which has a planar thermal conductivity of 800-1400 W/m.K, and a cohesion of 0.2-0.6 N/25 mm.