▎ 摘　　要

NOVELTY - Composite copper foil structure comprises copper foil core layer. The copper foil layer has opposite first surface and second surface along the thickness direction. A shell layer (12) is at least located on the first and second surfaces of the copper-foil core layer. The shell layer includes an N-layer graphene layer and an M-layer metal copper layer, which are alternately laminated with each other, N is an integer greater than 0, M is an integer greater than 0, and M = N or M = N-1. The surface of the shell close to the copper core layer is the graphene layer (1211). The thickness of the core layer of copper foil is greater than the thickness of metal copper in the shell layer. USE - The composite copper foil structure is useful for a copper-clad laminate and printed circuit board. Can also be used in integrated circuit, printed circuit boards, electronic element, energy storage device and aerospace equipment for signal transmission and electrical interconnection. ADVANTAGE - The method provides a composite structure with high conductivity; improves the surface conductivity of the composite structure, and improves the conductivity of the shell layer, and reduces the cost of the structure. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) a copper-clad laminate coated with copper foil; (2) a printed circuit board; and (3) a preparation method of composite copper foil structure. DESCRIPTION OF DRAWING(S) - Composite copper foil structure (10) Laminated copper foil core layer (11) Shell layer (12) Graphene layer (1211) Second layer graphene layer (1212) Third layer graphene layer (1213) Fourth layer graphene layer (1214) First layer metal copper layer (1221) Second layer metal copper layer (1222) Third layer metal copper layer (1223) Fourth layer metal copper layer (1224)