• 专利标题:   Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.
  • 专利号:   US2022238414-A1, KR2022108709-A, JP2022115094-A, TW202229503-A, JP7288102-B2
  • 发明人:   HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H
  • 专利权人:   CTRON ADVANCED MATERIAL CO LTD, CTRON ADVANCED MATERIAL CO LTD, HENAN XINLI NEW MATERIAL TECHNOLOGY CO
  • 国际专利分类:   H01L023/373, H05K007/20, H01L023/36, B32B015/04, B32B018/00, B32B009/00, C09K005/14
  • 专利详细信息:   US2022238414-A1 28 Jul 2022 H01L-023/373 202262 English
  • 申请详细信息:   US2022238414-A1 US541782 03 Dec 2021
  • 优先权号:   TW103093

▎ 摘  要

NOVELTY - Thermal conductive structure comprises a thermally conductive metal layer, and a structural layer arranged on the thermally conductive metal layer (11), where the structural layer is a stacked structure formed by a graphene layer (12) and a ceramic material layer or the structural layer is a graphene-mixed ceramic material layer. USE - Thermal conductive structure (claimed). ADVANTAGE - The structure has capable of improving heat dissipation performance, improving heat dissipation performance, has improved the thermal conductive effect, improving the heat dissipation performance of the electronic device, and has to achieve the requirement of a thin design of the electronic device, improving the heat dissipation performance of the flat light source, has improved the heat dissipation performance, and has improved the heat dissipation performance of the electronic device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device, which comprises a heat source, and a thermally conductive structure, where the thermally conductive structure is connected to the heat source. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the thermal conductive structure. Thermally conductive metal layer (11) Graphene layer (12) Filling material (132) Pores (133)