▎ 摘　　要

NOVELTY - Thermal conductive structure comprises a thermally conductive metal layer, and a structural layer arranged on the thermally conductive metal layer (11), where the structural layer is a stacked structure formed by a graphene layer (12) and a ceramic material layer or the structural layer is a graphene-mixed ceramic material layer. USE - Thermal conductive structure (claimed). ADVANTAGE - The structure has capable of improving heat dissipation performance, improving heat dissipation performance, has improved the thermal conductive effect, improving the heat dissipation performance of the electronic device, and has to achieve the requirement of a thin design of the electronic device, improving the heat dissipation performance of the flat light source, has improved the heat dissipation performance, and has improved the heat dissipation performance of the electronic device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device, which comprises a heat source, and a thermally conductive structure, where the thermally conductive structure is connected to the heat source. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the thermal conductive structure. Thermally conductive metal layer (11) Graphene layer (12) Filling material (132) Pores (133)