• 专利标题:   One-component thermosetting epoxy resin composition used for bonding substrates, comprises epoxy resin, hardener, and electroconductive carbon allotrope comprising conductive carbon black, graphene and/or multi-walled carbon nanotubes.
  • 专利号:   EP3670565-A1, WO2020127314-A1
  • 发明人:   KRUEGER C
  • 专利权人:   SIKA TECHNOLOGY AG, SIKA TECHNOLOGY AG
  • 国际专利分类:   C08G059/40, C08K003/04, C09D163/00, C09D005/44
  • 专利详细信息:   EP3670565-A1 24 Jun 2020 C08G-059/40 202055 Pages: 22 German
  • 申请详细信息:   EP3670565-A1 EP213277 18 Dec 2018
  • 优先权号:   EP213277

▎ 摘  要

NOVELTY - A one-component thermosetting epoxy resin composition comprises epoxy resin(s) (a) with an average of more than one epoxy group per molecule, hardener(s) (b) for epoxy resin, which is activated by elevated temperature, and an electroconductive carbon allotrope (c) comprising conductive carbon black (c1), 4-7 wt.% graphene (c2), 0.075-0.9 wt.% single-walled carbon nanotubes (c3) and/or 1.5-4 wt.% multi-walled carbon nanotubes (c4). USE - One-component thermosetting epoxy resin composition is used for bonding substrates for motor vehicle component (all claimed). ADVANTAGE - The one-component thermosetting epoxy resin composition provides product having improved esthetic appearance, corrosion resistance, tensile strength, elongation at break and elasticity modulus. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (i) bonding of heat-stable substrates, which involves applying the one-component thermosetting epoxy resin composition to a surface of a heat-stable substrate (S1), preferably metal, contacting the applied resin composition with a surface of a heat-stable substrate (S2), preferably metal, contacting the substrates and the resin composition with a cathodic dip-paint lacquer coating solution at a temperature of 20-80 degrees C, preferably 20-40 degrees C for 1-15 minutes, preferably 1-5 minutes, and heating at 140-220 degrees C, preferably 160-190 degrees C for 10-60 minutes, preferably 20-45 minutes; and (ii) use of the component (c) in the resin composition for reducing volume resistance according to DIN IEC167/IEC93/VDE 0303, measured at 23 degrees C and 50% relative air humidity and a measuring voltage of 10 V of a hardened resin composition of 1010 ( Omega ).cm or less, preferably 5x 107 ( Omega ).cm to 5x 108 ( Omega ).cm.