• 专利标题:   Preparation of composite transparent conductive film by preprocessing silver nanowires-graphene film-metal substrate composite structure, alignment bonding with photocurable liquid-coated flexible transparent substrate, and irradiating.
  • 专利号:   CN106297964-A
  • 发明人:   JIANG H, MA J, XU X
  • 专利权人:   CHONGQING GRAPHENE TECH CO LTD
  • 国际专利分类:   H01B001/02, H01B001/04, H01B013/00, H01B005/14
  • 专利详细信息:   CN106297964-A 04 Jan 2017 H01B-005/14 201728 Pages: 12 Chinese
  • 申请详细信息:   CN106297964-A CN10643280 08 Aug 2016
  • 优先权号:   CN10643280

▎ 摘  要

NOVELTY - Preparation of composite transparent conductive film includes chemical vapor depositing monocrystalline graphene into surface of metal substrate to obtain graphene film-metal substrate, dispersing silver nanowires, and drying to obtain silver nanowires-graphene film-metal substrate composite structure; and coating flexible transparent substrate with photocurable liquid material, performing alignment bonding with silver nanowires-graphene film-metal substrate composite structure, irradiating, and electrochemically stripping to separate metal substrate. USE - Method for preparation of composite transparent conductive film (claimed). ADVANTAGE - The method is simple, reliable and suitable for large-scale production. The composite transparent conductive film has excellent conductivity, high transmittance, and reliable performance. DETAILED DESCRIPTION - Preparation of composite transparent conductive film comprises chemical vapor depositing monocrystalline graphene into surface of metal substrate to obtain graphene film-metal substrate, dispersing silver nanowires, and drying to obtain silver nanowires-graphene film-metal substrate composite structure; coating flexible transparent substrate with photocurable liquid material to obtain photocurable liquid-coated flexible transparent substrate; alignment bonding photocurable liquid-coated flexible transparent substrate and silver nanowires-graphene film-metal substrate composite structure, irradiating, and electrochemically stripping to separate metal substrate.