▎ 摘　　要

NOVELTY - Multi-layer hole metallization involves mixing 8-10 wt.% graphene, 0.5-1 wt.% dispersant, 4-5.5 wt.% solvent, and water, ball milling into a graphene slurry having 14-15 wt.% solid content, mixing with 0.1-0.2 wt.% metal nanowire dispersion liquid, 9-10 wt.% polymeric conductive material, 0.5-0.9 wt.% thixotropic agent, high-speed dispersing into a stable conductive paste having 24-25 wt.% solid content, cleaning multilayer plate, washing, treating with conductive paste, drying, micro etching, washing, treating with an antioxidant, washing and drying. USE - Multi-layer hole metallization. ADVANTAGE - The method enables simple, easy to control, economical, environmentally-friendly, pollution-free multi-layer hole metallization of multilayer plate having stable performance, excellent conductivity, and strong bonding force.