▎ 摘　　要

NOVELTY - An epoxy resin thermal conductive composite material comprises an epoxy resin matrix and graphene-modified diamond particles filled in the epoxy resin matrix, and curing agent. The graphene-modified diamond particles comprise graphene grown on the surface of diamond particles. The mass ratio of the epoxy resin to the graphene-modified diamond is 1:0.5-1:2 and the mass ratio of the epoxy resin to the curing agent is 1:0.2-1:0.5. USE - Epoxy resin thermal conductive composite material used in circuit board, electric appliances, and aerospace and military equipment. ADVANTAGE - The epoxy resin composite material has high thermal conductivity, good electrical insulation property and simple preparation process. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of epoxy resin thermal conductive composite material, which involves mixing diamond with nickel powder in the mass ratio of 100:5 at 800-1200 degrees C under vacuum pressure 0-5 Pa, for 1-3 hours, adding 0.1-1 mol/l dilute hydrochloric acid, reacting at a speed of less than 100 rpm for 5-10 hours, removing the nickel powder from the mixture to prepare graphene-modified diamond, mixing graphene-modified diamond with epoxy resin, adding curing agent for 0.5-1.5 hours at 110-120 degrees C, solidifying for 0.5 hour at 130-140 degrees C, and curing for 1.5-2.5 hours at 170-175 degrees C.